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High-Reliability Backplate and Circuit Card Assembly Manufacturing

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract entails the manufacture of five high-reliability Backplate and Circuit Card Assemblies identified by NSN 6620-01-103-2509, fabricated to strict military specifications encompassing full lifecycle processes from component sourcing and fabrication to assembly and rigorous testing. The work is performed under a subcontract arrangement within the NAICS code 334418, indicating specialized electronic component manufacturing, and is managed by the Defense Logistics Agency under the Department of Defense. The procurement is scheduled for performance beginning in 2026, with the place of performance and point of contact details not specified, suggesting the contractor has flexibility in location but must meet exacting military performance and quality standards. All deliverables must comply with the technical and reliability requirements essential for military operations, ensuring operational readiness and durability under demanding conditions.

General Info

Manufacture five military-grade circuit assemblies to strict specs for DoD, performance begins 2026.

Agency

Department Of Defense → Defense Logistics AgencyView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE4A5-26-F-6706.

The full solicitation package (4 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

BACKPLATE AND CIRCU

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Timeline

PostedAug 5

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Defense Logistics Agency

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Office AddressN/A

ContactsNo contact information available

Full Description

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Manufacture of 5 high-reliability Backplate and Circuit Card Assemblies (NSN: 6620-01-103-2509) to military specifications, including fabrication, component sourcing, assembly, and testing.

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