BACKPLATE AND CIRCU

Delivery order SPE4A526F6706 was issued on May 27, 2026, by DLA Aviation to Parker-Hannifin Corporation for the procurement of five Backplate and Circuit Card Assemblies (NSN 6620-01-103-2509). The original award value was $35,428.90 with a delivery timeframe of 470 days after the date of order. Performance was to be executed at the contractor's facility in Hauppauge, New York, with inspection and acceptance occurring at the point of origin. The contract underwent several modifications, including the incorporation of FAR 52.222-90 regarding the prohibition of racially discriminatory DEI activities and a delivery date extension for CLIN 0001 to November 30, 2027, due to contractor system errors. However, a final modification issued on August 5, 2026, canceled CLIN 0001 in its entirety at no cost to either party due to a required redesign of the RCR resistors. This action reduced the total contract value to $0.00. Technical requirements for the order included strict adherence to MIL-STD-2073-1E for packaging and MIL-STD-129 for marking, with specific mandates for ESD and EMI protective packaging per MIL-PRF-81705. The contractor was also required to complete a CMMC Level 2 cybersecurity self-assessment. Administrative oversight was managed by Cynthia Beightol and Crystal Lloyd, with payments processed through DFAS via the Wide Area Workflow system.