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This Government Contract opportunity from Department Of Defense was posted on June 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

High-Reliability Electronic Component Assembly (Semiconductor Devices)

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Federal

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The Department of Defense, through the Maritime Supply Chain, is seeking a subcontractor for the high-reliability manufacturing and assembly of military-grade semiconductor electronic components, specifically part number 306-9003. The work will be performed in New Cumberland, Pennsylvania, under NAICS code 334413. Strict adherence to military standards is required, specifically J-STD-609 and MIL-STD-129, to ensure all marking, packaging, and labeling meet government specifications. The solicitation was posted on June 28, 2026, with a response deadline of July 9, 2026.

General Info

DoD seeks subcontractor for military semiconductor assembly in Pennsylvania by July 9, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M1-26-T-176H.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

ELECTRONIC COMPONEN

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → MARITIME SUPPLY CHAIN
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufacturing and assembly of military-grade electronic components (P/N: 306-9003) with compliance to J-STD-609 and MIL-STD-129 for marking, packaging, and labeling.

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