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High-Reliability Multi-Layer PCB Fabrication

Active

Federal

Response Deadline07/29/2026, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PostedJul 27

subcontract

Response DeadlineJul 29

Submission deadline

Response Deadline

07/29/2026, 08:00:00 PM UTCin 1 day

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Organization & Contact Information

AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Fabricate six 22-layer high-reliability PCBs with controlled impedance, blind/buried vias, and high Tg materials for aerospace use.

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