This Government Contract opportunity from National Aeronautics And Space Administration was posted on July 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
High-Reliability Multi-Layer PCB Fabrication
Contract Overview
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Six high-reliability 22-layer printed circuit boards are to be fabricated under a subcontract for NASA, with stringent requirements including controlled impedance, blind and buried vias, and high Tg materials to meet the demanding environmental and performance standards of aerospace applications. The work is targeted for use in critical systems where signal integrity, thermal stability, and durability under extreme conditions are essential, and the fabrication must adhere to industry-grade reliability benchmarks without exception. The solicitation was posted on July 27, 2026, with a response deadline of July 29, 2026, and is managed by the NASA Shared Services Center under NAICS code 334418, which classifies it within the printed circuit board manufacturing sector. There is no set-aside designation specified, and the place of performance is not defined, leaving the location of manufacturing open to the offeror’s facilities, provided all technical and quality requirements are met.
General Info
Agency
NAICS
Place of Performance
MSSet-Aside
Documents
This scope was carved out of 80NSSC26939777Q.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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