This Subcontract opportunity from Department Of Energy was posted on February 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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High-Reliability PCB Assembly (SMT & Through-Hole)

Closed

Federal

Submission Closed03/09/2026, 12:00:00 PM PDT

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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1 day ago

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in 10 days

AI Contract Overview

This subcontract opportunity, issued by the Berkeley National Labor DOE Contractor for the Department of Energy, involves high-reliability PCB assembly for BPM electronics. The scope of work encompasses both surface-mount and through-hole assembly, with specific requirements for fine-pitch BGA, conformal coating, and functional testing. To ensure quality and precision, the contractor must provide X-ray inspection, automated optical inspection, and rework services. The project will be performed in Berkeley and falls under NAICS code 334418. Interested parties must submit their responses by the deadline of March 9, 2026.

General Info

Agency

Department Of Energy → Berkeley National Labor - DOE Contractor

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Berkeley, CA, USA

Set-Aside

NONE

Documents

This scope was carved out of AA-2026-02.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Beam Position Monitor (BPM) and sub-assemblies for ALS-U

AI Contract Breakdown

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The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedFeb 27

subcontract

Response DeadlineMar 9

Deadline has passed

Submission Closed

03/09/2026, 12:00:00 PM PDT

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Organization & Contact Information

AgencyDepartment Of Energy → Berkeley National Labor - DOE Contractor

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Energy → Berkeley National Labor - DOE Contractor

Office AddressN/A

ContactsNo contact information available

Full Description

Surface-mount and through-hole assembly of BPM electronics, including fine-pitch BGA, X-ray inspection, AOI, rework, conformal coating, and functional testing.