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High-Reliability PCB Fabrication

Open

Federal

Response Deadline11/16/2026, 09:00:00 AM PST

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

TRACY, CA, 95304-5000, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-2637.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

AI Contract Breakdown

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Timeline

PostedNov 6

subcontract

Response DeadlineNov 16

Submission deadline

Response Deadline

11/16/2026, 09:00:00 AM PSTin 10 days

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

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Fabricates bare printed circuit boards for prime contractors on DLA Weapons Support projects. Manufactures boards according to MIL-PRF-31032 standards, utilizing high-reliability laminate materials equivalent to former MIL-S-13949 specifications. Delivers completed bare PCBs meeting military quality and reliability requirements.

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