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High-Reliability PCB Fabrication (Bare Board)

Open
Federal

Contract Overview

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This subcontract involves the fabrication of high-reliability bare printed circuit boards for prime contractors supporting the DLA Weapons Support Maritime Supply Chain. The project specifically requires the production of boards meeting NSN 5998-01-077-7666 specifications in accordance with MIL-PRF-31032, with lead attribute marking implemented per IPC/JEDEC J-STD-609. The contractor must utilize high-reliability substrates and maintain strict cybersecurity standards, including CMMC Level 2 and NIST SP 800-171 compliance. Performance for this Department of Defense effort is based in Tracy, California, with a response deadline of November 16, 2026.

General Info

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

TRACY, CA, 95304-5000, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M1-27-T-2102.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricates bare printed circuit boards for prime contractors on DLA Weapons Support Maritime Supply Chain projects. Fabricates boards to NSN 5998-01-077-7666 specifications per MIL-PRF-31032 and implements lead attribute marking per IPC/JEDEC J-STD-609. Requires high-reliability substrates and CMMC Level 2 / NIST SP 800-171 compliance. Delivers finished bare printed circuit boards.

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