High-Reliability PCB Fabrication (Bare Board)
Contract Overview
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AI Contract Overview
This subcontract involves the fabrication of high-reliability bare printed circuit boards for prime contractors supporting the DLA Weapons Support Maritime Supply Chain. The project specifically requires the production of boards meeting NSN 5998-01-077-7666 specifications in accordance with MIL-PRF-31032, with lead attribute marking implemented per IPC/JEDEC J-STD-609. The contractor must utilize high-reliability substrates and maintain strict cybersecurity standards, including CMMC Level 2 and NIST SP 800-171 compliance. Performance for this Department of Defense effort is based in Tracy, California, with a response deadline of November 16, 2026.
General Info
Place of Performance
TRACY, CA, 95304-5000, USASet-Aside
Documents
This scope was carved out of SPE7M1-27-T-2102.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMBLY
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