Hybrid Microcircuit Fabrication and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract involves the fabrication and assembly of hybrid microcircuits for prime contractors supporting the DLA Weapons Support Active Devices Division. The scope of work requires the use of lead-free materials and soldering equipment within a cleanroom environment to assemble components onto hybrid substrates. The specific deliverable consists of three units of NSN 5962-01-525-0495, accompanied by comprehensive supply chain traceability documentation. The project is categorized under NAICS code 334413 and will be performed in Columbus, Ohio. To be eligible, the provider must maintain strict adherence to CMMC Level 2 and DFARS 252.204-7012 compliance standards. The solicitation was posted on October 14, 2026, with a response deadline set for October 26, 2026.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-27-T-0995.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, HYBRID
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Timeline
Response Deadline
Organization & Contact Information
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