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Hybrid Microcircuit Fabrication and Supply

Open

Federal

Response Deadline11/23/2026, 12:00:00 PM EST

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-2764.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, HYBRID

AI Contract Breakdown

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Timeline

PostedNov 11

subcontract

Response DeadlineNov 23

Submission deadline

Response Deadline

11/23/2026, 12:00:00 PM ESTin 12 days

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies hybrid microcircuits for prime contractors on Defense Logistics Agency (DLA) supply contracts. Fabricates hybrid modules with ESD and physical protection for contacts, leads, and terminals. Packages components per MIL-STD-2073-1E and MIL-PRF-81705 for EMI and ESD protection. Marks lead finishes per MIL-STD-129 and IPC/JEDEC J-STD-609. Requires CMMC Level 2 self-assessment. Delivers physical microcircuits, test reports, and DLA Form 918.

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