This Government Contract opportunity from Department Of Defense was posted on May 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Inertial Sensor Integration & Packaging
Contract Overview
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AI Contract Overview
The contract focuses on the integration of mechanical, electronic, and optical sensor components into robust, manufacturable modules designed for field deployment. It involves creating inertial sensor systems that are ruggedized to withstand harsh operational environments, ensuring reliability and functionality in real-world conditions. This work is aimed at advancing sensor technology with a focus on practical application for defense or related fields. Issued by the Defense Advanced Research Projects Agency under the Department of Defense, the subcontract opportunity aligns with NAICS code 334511, which pertains to manufacturing industry sectors involving sensor and related component production. The contract was posted on May 29, 2026, with a response deadline of July 13, 2026. While specific details such as the solicitation number, set-aside status, and location of performance are not provided, the project is clearly intended to facilitate the development and packaging of integrated sensor modules that meet stringent military or defense standards.
General Info
Agency
NAICS
Place of Performance
VASet-Aside
Documents
This scope was carved out of DARPA-SN-26-88.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Future Program Announcement: Precision Inertial Navigation & Positioning On an Integrated Tesseract (PINPOINT)
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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