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Inertial Sensor Integration & Packaging

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract focuses on the integration of mechanical, electronic, and optical sensor components into robust, manufacturable modules designed for field deployment. It involves creating inertial sensor systems that are ruggedized to withstand harsh operational environments, ensuring reliability and functionality in real-world conditions. This work is aimed at advancing sensor technology with a focus on practical application for defense or related fields. Issued by the Defense Advanced Research Projects Agency under the Department of Defense, the subcontract opportunity aligns with NAICS code 334511, which pertains to manufacturing industry sectors involving sensor and related component production. The contract was posted on May 29, 2026, with a response deadline of July 13, 2026. While specific details such as the solicitation number, set-aside status, and location of performance are not provided, the project is clearly intended to facilitate the development and packaging of integrated sensor modules that meet stringent military or defense standards.

General Info

Development and manufacture of rugged inertial sensor modules for defense field deployment.

Agency

Department Of Defense → Defense Advanced Research Projects Agcy

NAICS

334511 - Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing View NAICS

Place of Performance

VA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

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subcontract

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Response Deadline

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Advanced Research Projects Agcy
Office AddressN/A
ContactsNo contact information available

Full Description

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Integrate mechanical, electronic, and optical sensor components into ruggedized, manufacturable modules suitable for field deployment.

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