Infrared Focal Plane Array (FPA) Design & Fabrication

The contract seeks the design, simulation, and fabrication of infrared focal plane arrays operating across the 3–14 micrometer wavelength range, encompassing both cooled and uncooled technologies in staring and scanning configurations. This effort targets advanced electro-optical sensor development for defense applications, requiring precise thermal imaging capabilities under diverse operational conditions. The work involves full-cycle development from theoretical modeling and simulation through to physical fabrication, with emphasis on performance, scalability, and integration readiness. Awarded as a subcontract under the Department of Defense’s Defense Advanced Research Projects Agency, the opportunity is governed by NAICS code 334418 and carries a response deadline of August 14, 2026, with the solicitation posted on July 17, 2026. While details on set-aside status or specific performance location are not provided, the scope implies collaboration with specialized semiconductor and infrared sensor manufacturers, demanding high technical rigor and adherence to defense-grade standards for reliability and sensitivity. The project is part of broader efforts to enhance next-generation infrared imaging systems for strategic and tactical use.