This Subcontract opportunity from Department Of Defense was posted on September 14, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Integrated RF and Microwave Photonics

Closed

Federal

Submission Closed09/23/2026, 08:00:00 AM EDT

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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AI Contract Overview

This subcontract with the Defense Advanced Research Projects Agency focuses on the supply and integration of RF and microwave photonic components for prime contractors on Strategic Technology Office projects. The primary objective is to integrate photonic circuits with radio frequency and microwave systems to facilitate high-bandwidth signal processing through the use of photonic integrated circuits, laser sources, modulators, and photodetectors. The contractor is responsible for delivering integrated RF-photonic hybrid systems or individual components under NAICS code 334413. This opportunity was posted on September 14, 2026, with a response deadline of September 23, 2026.

General Info

DARPA subcontract for supplying and integrating RF and microwave photonic components for projects.

Agency

Department Of Defense → Defense Advanced Research Projects Agcy

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Set-Aside

NONE

Documents

This scope was carved out of DARPA-SN-26-122.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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Timeline

PhaseClosed

PostedSep 14

subcontract

Response DeadlineSep 23

Deadline has passed

Submission Closed

09/23/2026, 08:00:00 AM EDT

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Organization & Contact Information

AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy

Office AddressN/A

ContactsNo contact information available

Full Description

Supplies and integrates RF and microwave photonic components for prime contractors on DARPA Strategic Technology Office projects. Integrates photonic circuits with radio frequency (RF) and microwave systems to enable high-bandwidth signal processing using photonic integrated circuits (PICs), laser sources, modulators, and photodetectors. Delivers integrated RF-photonic hybrid systems or components.