This Government Contract opportunity from Department Of Defense was posted on July 19, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Linear Microcircuit Manufacturing & Supply

Closed

Federal

Submission Closed07/30/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

The contract entails the full lifecycle production of defense-grade linear microcircuits meeting DLA Master List standards, encompassing all stages from wafer fabrication and rigorous testing to final packaging and comprehensive traceability documentation. All deliverables must comply with stringent military specifications to ensure reliability and performance in critical defense applications, with quality control embedded throughout each phase of manufacturing. Performance is required at the specified location in Columbus with a zip code of 43213, and the work falls under NAICS code 334418 for semiconductor and related device manufacturing. This is a subcontract opportunity issued by the Department of Defense’s Active Devices Division, with a response deadline of July 30, 2026, and the solicitation was posted on July 19, 2026. Bidders must ensure full adherence to federal defense supply chain requirements including documentation, material sourcing, and end-to-end accountability for delivered components.

General Info

Produce defense-grade microcircuits in Columbus, 43213, meeting military specs, by July 30, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-335Y.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, LINEAR

AI Contract Breakdown

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No contract breakdown available.

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Timeline

PhaseClosed

PostedJul 19

subcontract

Response DeadlineJul 30

Deadline has passed

Submission Closed

07/30/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ACTIVE DEVICES DIVISION

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Full lifecycle production of defense-grade linear microcircuits compliant with DLA Master List standards, including wafer fabrication, testing, packaging, and traceability documentation.