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Manufacturing and Supply of NRP, BOARD, PC, LOAD C

Active

Federal

Response Deadline10/30/2026, 12:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract, managed by the Department of Defense under the DLA Weapons Support Active Devices Division, involves the fabrication and assembly of NRP, BOARD, PC, LOAD C printed circuit boards. The scope of work requires the contractor to perform PCB fabrication and component population utilizing both surface mount technology and through-hole equipment to meet the requirements of prime contractors on DLA supply contracts. The contractor is responsible for the delivery of completed, labeled, and packaged hardware in strict accordance with MIL-STD-129 for marking and packaging and Federal Standard No. 313 for the handling of hazardous materials. This procurement falls under NAICS code 334418, with a response deadline set for October 30, 2026.

General Info

DoD subcontract for PCB fabrication and assembly due by October 30, 2026.

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

OH

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-1165.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

59--NRP,BOARD,PC,LOAD C

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Timeline

PostedOct 19

subcontract

Response DeadlineOct 30

Submission deadline

Response Deadline

10/30/2026, 12:00:00 PM UTCin 10 days

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

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Fabricates and assembles printed circuit boards for prime contractors on DLA supply contracts, specifically the NRP, BOARD, PC, LOAD C. Performs PCB fabrication and component population using SMT and through-hole equipment. Ensures compliance with MIL-STD-129 for marking and packaging and Federal Standard No. 313 for hazardous materials. Delivers completed, labeled, and packaged hardware.

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