Market Research Project for NSNs 5998016109246 & 5998016109247

Federal Business Opportunities (FedBizOpps) Synopsis Information Form NSN(s): 5998016109246 and 5998016109247 Delivery Schedule: 158 days and 116 days Item Description: Electronic Components Assembly and Electronic Component Destination Information: VARIOUS DLA STOCKING LOCATIONS RESPONSE DATE: Offers/Responses are due prior to the Closing Date and Time specified in BLOCK 9 on Page 1 of the Solicitation/Request for Proposal (RFP). (X) This acquisition is to establish an LTC for the abovementioned NSNs. The proposed procurement contains a three (3) year base with 2 one-year option periods. (X) While price may be a significant factor in the evaluation of offers, the final award decision will be based upon a combination of price, delivery, past performance and other evaluation factors as described in the solicitation. (X) Specifications, plans or drawings are not available. (X) Solicitation will be an Unrestricted acquisition. The solicitation will be available for download on the internet at https://www.dibbs.bsm.mil/RFP on or around February 11, 2022. (X) One or more of the items under this acquisition may be subject to an Agreement on Government Procurement approved and implemented in the United States by the Trade Agreements Act of 1979. All offers shall be in the English language and in U.S. dollars. All interested suppliers may submit an offer. (X) Based upon market research, the Government is not using the policies contained in Part 12, Acquisition of Commercial Items, in its solicitation for the described supplies or services. However, interested persons may identify to the contracting officer their interest and capability to satisfy the Government's requirement with a commercial item within 15 days of this notice. Increments and delivery schedule will be noted on the RFP. FOB Origin is required. Inspection/Acceptance requirements are Destination. All responsible sources may submit a quote, which shall be considered. ************************************************************************* CLIN: 0001 NSN: 5998016109246 Item Name: Electronic Components Assembly UI: EA ADQ: 12 ELECTRONIC COMPONENTS ASSEMBLY RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS (IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB AT: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS. RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES CRITICAL APPLICATION ITEM JOHN BEAN TECHNOLOGIES CORPORATION 54077 P/N L101187 PKGING DATA - MIL-STD-2073-1D, 15 DEC 1999 QUP:001 PRES MTHD:43 CLNG/DRY:1 PRESV MAT:00 WRAP MAT:00 CUSH/DUNN MAT:AD CUSH/DUNN THKNESS:F UNIT CONT:F2 OPI:M PACK CODE:U MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129. SPECIAL MARKING CODE:ZZ -ZZ Special Requirements PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT PACKAGE DESIGN PERFORMANCE CRITERIA INCLUDES SAFE DELIVERY OF ELECTRONIC DEVICES TO ULTIMATE USER(S). ZZ - SPECIAL MARKING REQUIREMENTS: UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH (a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.1 of the standard. (b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. WHEN SPECIFIED/REQUIRED: PER MIL-STD-129, SERIAL NUMBER SHALL BE MARKED ON THE UNIT, INTERMEDIATE, AND SHIPPING CONTAINERS. IF SERIAL NUMBER MARKING REQUIRED, THE PACKING LIST SHALL CONTAIN SERIAL NUMBERS PER MIL-STD-129R, PARAGRAPHS 5.4.1.1.1, 5.4.1.1.2, 5.4.1.2.1, AND 5.4.1.2.2. IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS ***************************************************************************************************************************** CLIN: 0002 NSN: 5998016109247 Item Name: Electronic Components UI: EA ADQ: 45 ELECTRONIC COMPONENT RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS (IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB AT: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS. RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES JOHN BEAN TECHNOLOGIES CORPORATION 54077 P/N L101186 JOHN BEAN TECHNOLOGIES CORPORATION 54077 P/N L101231 ITEM 80 PKGING DATA - MIL-STD-2073-1D, 15 DEC 1999 QUP:001 PRES MTHD:ZZ CLNG/DRY:1 PRESV MAT:00 WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:Z UNIT CONT:E5 OPI:M INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA PACK CODE:U MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129. SPECIAL MARKING CODE:ZZ -ZZ Special Requirements PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT NO TECHNICAL DATA AVAILABLE. REQUEST SUPPLIER PROVIDE DATA, SO ELECTROSTATIC SENSITIVE DEVICE/ELECTROMAGNETIC INTERFERENCE (ESD/EMI) CAN BE VERIFIED AND PROPER PACKAGING REQUIREMENTS ASSIGNED. REQUEST DATA BE SENT TO BUYER, THEN FORWARD TO THE PACKAGING SPECIALIST FOR EVALUATION AND PACKAGING REQUIREMENTS BE UPDATED PRIOR TO AWARD. NO COMMERCIAL PACKAGING PERMITTED. ESD STATUS SHALL BE DETERMINED PRIOR TO CONTRACT AWARD & PACKAGING REQUIREMENTS UPDATED. ALL ESD SENSITIVE DEVICES ARE REQUIRED TO BE PACKAGED IN ACCORDANCE WITH MIL-STD-2073-1<(>,<)> METHOD OF PRESERVATION CODE "GX" - NO WAIVERS OR DEVIATIONS PERMITTED. FOR NON-SENSITIVE DEVICES, METHOD OF PRESERVATION CODE 41 APPLIES. ATTENTION: COMMERCIAL PACKAGING SHALL NOT BE UTILIZED. PACKAGE DESIGN PERFORMANCE CRITERIA INCLUDES SAFE DELIVERY OF ELECTRONIC DEVICES TO ULTIMATE USER(S). ZZ - SPECIAL MARKING REQUIREMENTS: UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH (a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.1 of the standard. (b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. WHEN SPECIFIED/REQUIRED: PER MIL-STD-129, SERIAL NUMBER SHALL BE MARKED ON THE UNIT, INTERMEDIATE, AND SHIPPING CONTAINERS. IF SERIAL NUMBER MARKING REQUIRED, THE PACKING LIST SHALL CONTAIN SERIAL NUMBERS PER MIL-STD-129R, PARAGRAPHS 5.4.1.1.1, 5.4.1.1.2, 5.4.1.2.1, AND 5.4.1.2.2. IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS