Military-Standard Microelectronics Packaging and Secure Disposal
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract for DLA Land and Maritime involves the specialized packaging and secure disposal of microcircuits for prime contractors. The scope of work requires shipments to be packaged using moisture barrier bags and ESD shielding in strict accordance with MIL-STD-2073/1 and MIL-STD-129. Additionally, the contractor is responsible for the secure destruction of unusable inventory using certified shredding equipment as mandated by CNSSI 3006, providing both MIL-SPEC compliant shipments and official Certificates of Destruction. The opportunity is categorized under NAICS code 484220 and is associated with the Department of Defense. Interested parties must note the response deadline of November 30, 2026.
General Info
Place of Performance
OH, USASet-Aside
Documents
This scope was carved out of SPE7MX27R9999.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Long-Term Storage and Vendor-Managed Inventory (VMI) Services for Government-Owned Microelectronics
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Timeline
Response Deadline
Organization & Contact Information
Full Description
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