This Subcontract opportunity from National Aeronautics And Space Administration was posted on December 18, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Metrology and Quality Verification for Etched SiC Wafers
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The NASA Shared Services Center is seeking a subcontractor for metrology and quality verification of etched silicon carbide wafers. The primary objective is to provide post-etch metrology to ensure strict adherence to technical specifications, including a thickness of 50 plus or minus 2.5 micrometers, a uniformity of plus or minus 5 percent, and an aspect ratio of 5 or greater. Additionally, the contractor must verify sidewall quality and confirm the absence of scalloping or notching. To achieve these verification goals, the contractor is expected to utilize specialized measurement techniques such as scanning electron microscopy, profilometry, or interferometry. This opportunity was posted on December 18, 2025, with a response deadline of December 22, 2025, falling under NAICS code 541380.
General Info
Place of Performance
MS, USASet-Aside
Documents
This scope was carved out of 80NSSC26921522Q.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
Deep Reactive Ion Etching of Single Crystal 4H-SiC
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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