This Government Contract opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Microcircuit Assembly Fabrication (P/N 4011174-903)

Closed

Federal

Submission Closed10/23/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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Supplier of Memory Microcircuits (NSN 5962-01-567-9623)This subcontract involves the supply of eight memory microcircuits, specifically NSN 5962-01-567-9623, to prime contractors supporting the DLA Weapons Support Active Devices Division. The selected supplier is responsible for manufacturing or sourcing these components using cleanroom facilities and ESD-protected handling. Strict adherence to technical standards is required, including IPC/JEDEC J-STD-609 for lead finish markings and MIL-STD-2073-1E and MIL-STD-129 for packaging. The contract mandates compliance with the Buy American Act and DFARS cybersecurity regulations. Deliveries must be accompanied by DLA Form 918 and full traceability documentation. Performance for this requirement is centered in Columbus, Ohio, under NAICS code 334413, with a response deadline of November 9, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Printed Circuit Board (PCB) Fabrication

DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN

POSTED

about 10 hours ago

DEADLINE

in 12 days

AI Contract Overview

This subcontract involves the fabrication of 12 microcircuit assemblies for the Department of Defense, specifically under the DLA Weapons Support Active Devices Division. The contractor is responsible for manufacturing these assemblies according to Honeywell P/N 4011174-903 specifications, which includes applying lead finishes and performing marking in accordance with IPC/JEDEC J-STD-609 standards. To ensure quality and security, the provider must utilize cleanroom facilities and maintain a CMMC Level 2 self-assessment. Additionally, the contract mandates full supply chain traceability through the submission of DLA Land and Maritime Form 918. Performance for this project is centered in Columbus, Ohio, under NAICS code 334413.

General Info

Fabricate 12 microcircuit assemblies for DoD in Ohio following Honeywell and IPC specifications.

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-0577.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT ASSEMBLY

AI Contract Breakdown

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Timeline

PhaseClosed

PostedOct 12

subcontract

Response DeadlineOct 23

Deadline has passed

Submission Closed

10/23/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Manufactures microcircuit assemblies for prime contractors on DLA Weapons Support projects. Fabricates assemblies to Honeywell P/N 4011174-903 specifications, applies lead finishes, and performs marking per IPC/JEDEC J-STD-609. Requires cleanroom facilities and CMMC Level 2 self-assessment. Provides full supply chain traceability via DLA Land and Maritime Form 918. Delivers 12 completed microcircuit assemblies.