MICROCIRCUIT, DIGITAL
Active
SPE7M1-26-T-352PFederalResponse Deadline
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
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Solicitation SPE7M1-26-T-352P is a Request for Quotations issued by the DLA Land and Maritime Supply Chain for the procurement of 186 units of a digital microcircuit, specifically NSN 596201595577 (Linear Technology LLC P/N LT1720IMS8). The requirement is for a qualified item under Federal Supply Class 5962, and the government has determined that surplus items are not acceptable. The delivery is set for FOB Origin with a need ship date of February 2, 2027, and an original required delivery date of May 1, 2027, with inspection and acceptance occurring at the destination in Columbus, Ohio. The contract imposes stringent quality and security requirements, including CMMC Level 2 Self-Assessment and the maintenance of supply chain traceability documentation. Contractors must provide a completed DLA Land and Maritime Form 918 and associated traceability or test reports to the contract administrator at least 15 days prior to the delivery date to receive shipping authorization. Packaging must adhere to MIL-STD-129 and MIL-PRF-81705 for ESD and EMI protection, utilizing approved barrier materials and specific cushioning to prevent lead damage. Additionally, unit package marking must comply with IPC/JEDEC J-STD-609 to identify lead finish attributes. All quotes must be submitted via the DIBBS system, and payments will be processed through the Wide Area WorkFlow system.
General Info
DLA seeks 186 digital microcircuits (NSN 596201595577) for delivery by May 1, 2027.
Place of Performance
STORAGE AND DISTRIBUTION DETACHMENT, COLUMBUS, OH, 43213, USASet-Aside
NONE
Timeline
1 update
PhaseSolicitation
Response Deadline
Organization & Contact Information
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AgencyDepartment Of Defense → MARITIME SUPPLY CHAIN
Contacts1 person available
OfficeUSA
Full Description
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MICROCIRCUIT,DIGITAL
MICROCIRCUIT,DIGITA
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RD002, COVERED DEFENSE INFORMATION APPLIES
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment FEDERAL SUPPLY CLASS (FSC) 5962 ELECTRONIC MICROCIRCUITS (MAR 2016)
(a) This procurement is for an item in Federal Supply Class (FSC) 5962, Electronic Microcircuits. For this acquisition, the definition of "exact product" in the provision at Procurement Note L04 is modified to include parts provided by an approved source specified in the product item description (PID) of the contract that are marked with the CAGE and part number of an authorized manufacturer of that approved source.
(b) In addition to the following requirements outlined in paragraphs (c) through (d) below, documentation of traceability and test shall be maintained and provided in accordance with the clauses in this solicitation/contract.
SPE7M1-26-T-352P
SECTION B
(c) DLA Land and Maritime Form 918 as cited below is required on contracts awarded with inspection at destination. For contracts awarded with inspection at source, the documentation required per the contract will be verified by the Government QAR.
(1) The contractor shall provide documentation of traceability or a test report in accordance with the requirements outlined in block 6 of the DLA Land and Maritime Form 918, Traceability/Test Documentation Cover Sheet.
(2) Not later than 15 days prior to the Delivery Date specified in the contract, the contractor shall email a copy of the completed DLA L<(>&<)>M Form 918 to Maritime.CDAP.Monitor@dla.mil, along with unredacted traceability documentation or a complete test report as required for the contractor by Block 6 of the DLA L<(>&<)>M Form 918. The contractor is not authorized to ship material until the contractor receives written confirmation from the contract administrator stating that the submitted traceability documentation or test report is adequate and that the contractor may proceed with shipment.
(3) Once authorized to ship, the contractor shall include within the packaging for each lot shipped a paper copy of the DLA L<(>&<)>M Form 918 and a copy of the written confirmation from the contract administrator authorizing shipment.
(4) Any payment by the Government will not be final if (i) the material is shipped without authorization from the contract administrator, or (ii) it is determined subsequent to receipt of the parts that the approved traceability documentation/test report is not included within the packaging of the parts shipped, or
(iii) it is determined subsequent to receipt of the parts that the traceability documentation/test report and DLA L<(>&<)>M Form 918 included in the packaging is not the identical documentation that was the basis for the contract administrator to provide authorization for the contractor to ship.
(d) When submitting emails containing attachments of digital copies of traceability or test documentation, the contractor shall (1) Limit the size of each email (including all attachments) to less than 15 megabytes. Large attached files shall be compressed (zip file) in a manner to ensure that all documentation fits within one emailfor each lot shipped. (2) Title both the attached documentation and the subject heading of the email using the following naming convention: "Documentation Type Contract Number<(>,<)> CLIN, NSN." For example: "Traceability Documentation SPE7M500C0026, 0001<(>,<)> 5962002695308"
"Test Report SPM7M500M7650, 0001, 5962010043894"
(e) The DLA L<(>&<)>M Form 918 may be obtained from the DLA Counterfeit Detection and Avoidance Program (CDAP) web page found at: http://www.dla.mil/LandandMaritime/Business/Selling/ http://www.dla.mil/LandandMaritime/Business/Selling/ CounterfeitDetectionAvoidanceProgram.aspx. IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of
SPE7M1-26-T-352P
SECTION B
IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
LINEAR TECHNOLOGY LLC 64155 P/N LT1720IMS8
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017780819 0001 EA 186.000
NSN/MATERIAL:5962015955577
DELIVERY (IN DAYS):0129
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:K3 CUSH/DUNN MAT:NB CUSH/DUNN THKNESS:A
UNIT CONT:B9 OPI:M
INTRMDTE CONT:D3 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in
SPE7M1-26-T-352P
SECTION B
PR: 7017780819 PRLI: 0001 CONT’D
accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals. UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
ZZ ADDITIONAL SPECIAL MARKING: 39 ESD sensitive electronic device requirements of MIL-STD-129 apply CUSH/DUNN MAT: ZZ # CUSHIONING REQUIREMENT: A-A-59136, CLASS 1, GRADE B, MINIMUM DENSITY: 1.7 pounds per cubic feet, MAXIMUM DENSITY: 2.2 pounds per cubic feet. CUSH/DUNN THKNESS: Z Cushioning thickness will be at least 1/8 of an inch thicker than the length of the component's leads. In lieu of these requirements, components can be placed in ESD
SPE7M1-26-T-352P
SECTION B
PR: 7017780819 PRLI: 0001 CONT’D
protective form fitting containers that immobilize and maintain the original configuration of the leads. Additional anti-static cushioning may be applied to protect the component.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
SW0700
DLA DISTRIBUTION DDWO
3990 EAST BROAD ST BLDG 11 SEC 8
STORAGE AND DISTRIBUTION DETACHMENT
COLUMBUS OH 43213
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SW0700
DLA DISTRIBUTION DDWO
3990 EAST BROAD ST BLDG 11 SEC 8
STORAGE AND DISTRIBUTION DETACHMENT
COLUMBUS OH 43213
US
Need Ship Date:02/02/2027 Original Required Delivery Date:05/01/2027
SPE7M1-26-T-352P NSN/Part Number: 5962-01-595-5577 Quantity: 186 EA Purchase Request: 7017780819QTY: 186 Delivery: 129 days ADO
MICROCIRCUIT,DIGITA
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RD002, COVERED DEFENSE INFORMATION APPLIES
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment FEDERAL SUPPLY CLASS (FSC) 5962 ELECTRONIC MICROCIRCUITS (MAR 2016)
(a) This procurement is for an item in Federal Supply Class (FSC) 5962, Electronic Microcircuits. For this acquisition, the definition of "exact product" in the provision at Procurement Note L04 is modified to include parts provided by an approved source specified in the product item description (PID) of the contract that are marked with the CAGE and part number of an authorized manufacturer of that approved source.
(b) In addition to the following requirements outlined in paragraphs (c) through (d) below, documentation of traceability and test shall be maintained and provided in accordance with the clauses in this solicitation/contract.
SPE7M1-26-T-352P
SECTION B
(c) DLA Land and Maritime Form 918 as cited below is required on contracts awarded with inspection at destination. For contracts awarded with inspection at source, the documentation required per the contract will be verified by the Government QAR.
(1) The contractor shall provide documentation of traceability or a test report in accordance with the requirements outlined in block 6 of the DLA Land and Maritime Form 918, Traceability/Test Documentation Cover Sheet.
(2) Not later than 15 days prior to the Delivery Date specified in the contract, the contractor shall email a copy of the completed DLA L<(>&<)>M Form 918 to Maritime.CDAP.Monitor@dla.mil, along with unredacted traceability documentation or a complete test report as required for the contractor by Block 6 of the DLA L<(>&<)>M Form 918. The contractor is not authorized to ship material until the contractor receives written confirmation from the contract administrator stating that the submitted traceability documentation or test report is adequate and that the contractor may proceed with shipment.
(3) Once authorized to ship, the contractor shall include within the packaging for each lot shipped a paper copy of the DLA L<(>&<)>M Form 918 and a copy of the written confirmation from the contract administrator authorizing shipment.
(4) Any payment by the Government will not be final if (i) the material is shipped without authorization from the contract administrator, or (ii) it is determined subsequent to receipt of the parts that the approved traceability documentation/test report is not included within the packaging of the parts shipped, or
(iii) it is determined subsequent to receipt of the parts that the traceability documentation/test report and DLA L<(>&<)>M Form 918 included in the packaging is not the identical documentation that was the basis for the contract administrator to provide authorization for the contractor to ship.
(d) When submitting emails containing attachments of digital copies of traceability or test documentation, the contractor shall (1) Limit the size of each email (including all attachments) to less than 15 megabytes. Large attached files shall be compressed (zip file) in a manner to ensure that all documentation fits within one emailfor each lot shipped. (2) Title both the attached documentation and the subject heading of the email using the following naming convention: "Documentation Type Contract Number<(>,<)> CLIN, NSN." For example: "Traceability Documentation SPE7M500C0026, 0001<(>,<)> 5962002695308"
"Test Report SPM7M500M7650, 0001, 5962010043894"
(e) The DLA L<(>&<)>M Form 918 may be obtained from the DLA Counterfeit Detection and Avoidance Program (CDAP) web page found at: http://www.dla.mil/LandandMaritime/Business/Selling/ http://www.dla.mil/LandandMaritime/Business/Selling/ CounterfeitDetectionAvoidanceProgram.aspx. IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of
SPE7M1-26-T-352P
SECTION B
IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
LINEAR TECHNOLOGY LLC 64155 P/N LT1720IMS8
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017780819 0001 EA 186.000
NSN/MATERIAL:5962015955577
DELIVERY (IN DAYS):0129
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:K3 CUSH/DUNN MAT:NB CUSH/DUNN THKNESS:A
UNIT CONT:B9 OPI:M
INTRMDTE CONT:D3 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in
SPE7M1-26-T-352P
SECTION B
PR: 7017780819 PRLI: 0001 CONT’D
accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals. UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
ZZ ADDITIONAL SPECIAL MARKING: 39 ESD sensitive electronic device requirements of MIL-STD-129 apply CUSH/DUNN MAT: ZZ # CUSHIONING REQUIREMENT: A-A-59136, CLASS 1, GRADE B, MINIMUM DENSITY: 1.7 pounds per cubic feet, MAXIMUM DENSITY: 2.2 pounds per cubic feet. CUSH/DUNN THKNESS: Z Cushioning thickness will be at least 1/8 of an inch thicker than the length of the component's leads. In lieu of these requirements, components can be placed in ESD
SPE7M1-26-T-352P
SECTION B
PR: 7017780819 PRLI: 0001 CONT’D
protective form fitting containers that immobilize and maintain the original configuration of the leads. Additional anti-static cushioning may be applied to protect the component.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
SW0700
DLA DISTRIBUTION DDWO
3990 EAST BROAD ST BLDG 11 SEC 8
STORAGE AND DISTRIBUTION DETACHMENT
COLUMBUS OH 43213
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SW0700
DLA DISTRIBUTION DDWO
3990 EAST BROAD ST BLDG 11 SEC 8
STORAGE AND DISTRIBUTION DETACHMENT
COLUMBUS OH 43213
US
Need Ship Date:02/02/2027 Original Required Delivery Date:05/01/2027
SPE7M1-26-T-352P NSN/Part Number: 5962-01-595-5577 Quantity: 186 EA Purchase Request: 7017780819QTY: 186 Delivery: 129 days ADO
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