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Microelectronics Original Component Manufacturing (OCM/IDM)

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Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract opportunity, titled Microelectronics Original Component Manufacturing (OCM/IDM), is issued by the Department of Defense through the W0ML USA Deputy Tobyhanna. The contract focuses on the production of COTS, industrial, and defense-grade microelectronics to support Department of the Army supply chain projects. The selected provider will be responsible for the full lifecycle of semiconductor device production, including raw silicon and wafer fabrication, assembly, packaging, and testing, culminating in high-volume production runs of finished components. To ensure operational reliability and security, the contractor must implement Vendor-Managed Inventory and buffer stocks while maintaining strict lot-level provenance tracing. Compliance with recognized quality management systems, specifically ISO 9001, AS9100, or IATF 16949, is mandatory. Interested parties must submit their responses by October 27, 2026, for performance located in zip code 18466.

General Info

DoD subcontract for microelectronics production and supply chain support due October 27, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

PA, 18466, USA

Set-Aside

NONE

Documents

This scope was carved out of MicroelectronicsSourcingforTYAD2.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)

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Organization & Contact Information

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AgencyDepartment Of Defense → W0ML USA Deputy Tobyhanna
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufactures COTS, industrial, and defense-grade microelectronics for prime contractors on Department of the Army supply chain projects. Performs raw silicon/wafer fabrication, assembly, packaging, and testing of semiconductor devices. Implements Vendor-Managed Inventory (VMI) and buffer stocks. Requires ISO 9001, AS9100, or IATF 16949 quality systems and lot-level provenance tracing. Delivers finished microelectronic components in high-volume production runs.

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NAICS: 334413
Federal
Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)
Solicitation # MicroelectronicsSourcingforTYAD2
The U.S. Army Contracting Command and Tobyhanna Army Depot are conducting market research through a Request for Information to identify qualified Original Component Manufacturers and Tier-1 direct distributors capable of supplying commercial-off-the-shelf, industrial, and defense-grade microelectronics. The primary goal is to move away from decentralized, broker-dependent procurement toward resilient, long-term direct relationships to support Circuit Card Assembly integration. The government is seeking partners who can sustain large-scale production volumes, ranging from hundreds of thousands to multi-million-unit annual runs, while maintaining vendor-managed inventory and the ability to handle rapid demand surges. To ensure supply chain integrity and anti-counterfeiting, the government requires strict provenance tracing from raw silicon and wafer fabrication through assembly and testing. Compliance with DoDI 5200.50, DFARS 252.246-7007/7008, and quality systems such as ISO 9001, AS9100, or IATF 16949 is essential, with AEC-Q200 qualification preferred for multilayer ceramic capacitors. Interested respondents must submit a capability package by October 27, 2026, detailing their corporate profile, supply tier classification, and manufacturing capacity. This RFI is for planning purposes only and does not constitute a formal solicitation or obligation for contract award.
Semiconductor and Related Device Manufacturing

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13 days ago

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