Microelectronics Original Component Manufacturing (OCM/IDM)
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract opportunity, titled Microelectronics Original Component Manufacturing (OCM/IDM), is issued by the Department of Defense through the W0ML USA Deputy Tobyhanna. The contract focuses on the production of COTS, industrial, and defense-grade microelectronics to support Department of the Army supply chain projects. The selected provider will be responsible for the full lifecycle of semiconductor device production, including raw silicon and wafer fabrication, assembly, packaging, and testing, culminating in high-volume production runs of finished components. To ensure operational reliability and security, the contractor must implement Vendor-Managed Inventory and buffer stocks while maintaining strict lot-level provenance tracing. Compliance with recognized quality management systems, specifically ISO 9001, AS9100, or IATF 16949, is mandatory. Interested parties must submit their responses by October 27, 2026, for performance located in zip code 18466.
General Info
Place of Performance
PA, 18466, USASet-Aside
Documents
This scope was carved out of MicroelectronicsSourcingforTYAD2.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)
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