MIL-SPEC Aerospace Electronics Packaging
Contract Overview
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AI Contract Overview
This subcontract, titled MIL-SPEC Aerospace Electronics Packaging, involves providing barrier materials and preservation packaging services for prime contractors supporting the DLA Weapons Support Active Devices Division. The scope of work requires packaging components according to MIL-STD-2073-1E using Preservation Method GX and Special Marking Code 39, utilizing DOD qualified MIL-PRF-81705 barrier materials. The final preserved circuit card assemblies must be delivered ready for shipment to the DLA Distribution Depot Hill. The opportunity is designated as a Total Small Business Set-Aside under NAICS code 333613. Performance will take place at Hill AFB, Utah. Interested parties must respond by November 9, 2026, for this Department of Defense project.
General Info
Place of Performance
HILL AFB, UT, 84056-5734, USASet-Aside
Documents
This scope was carved out of SPE7M5-27-T-1602.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMBLY
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