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MIL-SPEC Electronic Component Packaging

Open
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract for the DLA Weapons Support Nuclear Reactor Program involves providing specialized packaging and cushioning for critical microcircuits. The contractor is responsible for ensuring all components are packaged according to MIL-STD-2073-1E, with specific requirements for EMI/ESD protection per MIL-PRF-81705 and cushioning per A-A-59136. The scope of work includes the use of ESD-safe bagging and EMI shielding materials to deliver fully packaged, marked, and shielded microcircuits to prime contractors. The project is managed by the Department of Defense under NAICS code 488510, with performance taking place in Columbus, Ohio. Interested parties must note the response deadline of November 16, 2026, following the posting date of November 6, 2026.

General Info

Subcontract for specialized microcircuit packaging and shielding for DLA Nuclear Reactor Program.

NAICS

488510 - Freight Transportation Arrangement

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M2-27-T-0796.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, DIGITAL

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT NUCLEAR REACTOR PROGRAM
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs specialized packaging and cushioning for critical microcircuits for prime contractors on DLA Weapons Support Nuclear Reactor Program projects. Packages components per MIL-STD-2073-1E, implements EMI/ESD protection per MIL-PRF-81705, and applies cushioning per A-A-59136. Utilizes ESD-safe bagging, EMI shielding materials, and A-A-59136 compliant cushioning. Delivers packaged, marked, and shielded microcircuits.

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