This Subcontract opportunity from Department Of Defense was posted on October 13, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
MIL-SPEC Electronic Component Packaging
Contract Overview
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This subcontract opportunity is for the DLA Weapons Support Active Devices Division to provide specialized packaging for microcircuits. The selected contractor must utilize ESD-safe workstations and EMI shielding materials to ensure compliance with MIL-PRF-81705 and MIL-STD-2073-1E standards, while marking unit packages according to IPC/JEDEC J-STD-609. The project requires the delivery of 16 individually packaged and marked microcircuits ready for FOB Origin shipment, and the performing party must hold certification in MIL-STD packaging standards. The contract is a total small business set-aside under NAICS code 488410, with performance taking place in Columbus, Ohio. Interested parties must respond by October 26, 2026. This effort supports prime contractors within the Department of Defense to ensure critical electronic components are handled and preserved according to strict military specifications.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-27-T-0941.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITAL
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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