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MIL-STD-2073 Packaging Services

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract involves providing specialized packaging services for sensitive electronic module processors supporting NAVSUP projects for the Department of Defense. The contractor is responsible for ensuring all repaired modules are packaged according to MIL-STD-2073 standards, specifically utilizing MIL-SPEC anti-static bags and reinforced crates to provide essential moisture-proof and electrostatic discharge protection for delivery to DLA Distribution centers. The scope of work requires the delivery of properly packaged and labeled module processors that are fully prepared for shipment. This opportunity falls under NAICS code 339999, with a response deadline of September 25, 2026.

General Info

Packaging sensitive electronic modules per MIL-STD-2073 for DoD projects by September 25, 2026.

Agency

Department Of Defense → Navsup Weapon Systems Support MechView Agency

NAICS

339999 - All Other Miscellaneous ManufacturingView NAICS

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010426QQB97.

The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MODULE PROCESSOR

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Navsup Weapon Systems Support Mech
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Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies and performs specialized packaging for sensitive electronic modules for prime contractors on NAVSUP projects. Packages repaired Module Processors in accordance with MIL-STD-2073, ensuring moisture-proof and electrostatic discharge (ESD) protection. Uses MIL-SPEC anti-static bags and reinforced crates for DLA Distribution centers. Delivers properly packaged and labeled Module Processors ready for shipment.

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Miguel
Hillary
Keith Deutsch
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