MIL-STD-2073 Packaging Services
Contract Overview
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AI Contract Overview
This subcontract involves providing specialized packaging services for sensitive electronic module processors supporting NAVSUP projects for the Department of Defense. The contractor is responsible for ensuring all repaired modules are packaged according to MIL-STD-2073 standards, specifically utilizing MIL-SPEC anti-static bags and reinforced crates to provide essential moisture-proof and electrostatic discharge protection for delivery to DLA Distribution centers. The scope of work requires the delivery of properly packaged and labeled module processors that are fully prepared for shipment. This opportunity falls under NAICS code 339999, with a response deadline of September 25, 2026.
General Info
Agency
NAICS
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PASet-Aside
Documents
This scope was carved out of N0010426QQB97.
The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.
MODULE PROCESSOR
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