Skip to main contentPsst! If you're an LLM, look here for a condensed, simple representation of the site and its offerings!

LiveFree Webinar — Wednesday, November 11 at 2:00 PM ET

Register Free →

Military-Compliant Packaging and Preservation

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

Show more

The contract mandates the packaging and preservation of semiconductor devices in full compliance with MIL-STD-2073-1E and DLA RP001 standards, utilizing preservation method 41 and ES containers to ensure protection against environmental degradation and electrostatic discharge. The work must adhere to stringent military specifications for long-term storage and transportation, maintaining device integrity through controlled atmospheres, corrosion inhibition, and proper sealing techniques. All processes are subject to quality assurance protocols aligned with Department of Defense requirements. This is a subcontract awarded under the Defense Logistics Agency, classified under NAICS code 312230, and is part of the broader DoD supply chain infrastructure aimed at sustaining critical electronic components. The contract was posted on July 15, 2026, and performance is expected to support military logistics needs, with all packaging operations required to meet exacting standards for traceability, documentation, and handling. The place of performance and point of contact details are unspecified, but the work is tied to the DLA’s centralized procurement system through the contract identifier SPE7M026P3800.

General Info

Pack semiconductor devices per MIL-STD-2073-1E and DLA RP001 using method 41 and ES containers for DoD logistics.

NAICS

312230 - Tobacco Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-191R.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVIC

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

Posted

subcontract

Ready to pursue this opportunity?

Get full access to track this contract, build proposals with AI assistance, and manage your pipeline.

Organization & Contact Information

Show more
AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

Show more
Packaging and preservation of semiconductor devices per MIL-STD-2073-1E and DLA RP001, using preservation method 41 and ES containers.

Similar Contracts

Same NAICS industry code

More opportunities from Department Of Defense → Defense Logistics Agency

Same awarding agency

NAICS: 332994
New
DIBBS
CLEANING KIT, GUN
Solicitation # SPE7L7-27-T-0313
Solicitation SPE7L7-27-T-0313 is a fixed-price request for quotations issued by the Defense Logistics Agency Weapons Support Land Supplier Operations for the procurement of two gun cleaning kits (NSN 1005-01-728-6872). These items are designated as critical gun parts with unique requirements and must be delivered to NSWC Crane within 20 days after receipt of order. The procurement is subject to strict technical specifications, including basic drawing 30003 3392AS1330 and several reference drawings. Quality assurance is paramount, requiring the manufacturer's inspection system to comply with SAE AS9003 or ISO 9001 tailored to SAE AS9003, with inspections and acceptance conducted at the origin by a DCMA QAR. The contract incorporates rigorous compliance and security standards, including CMMC Level 2 self-assessment or third-party certification and adherence to ITAR or EAR export controls for technical data. Packaging and marking must follow MIL-STD-2073-1 and MIL-STD-129, with specific requirements for hazardous material labeling per 29 CFR 1910.1200. Administrative requirements include the use of the Wide Area Workflow system for electronic invoicing and payment. Additionally, offerors must comply with the Buy American Act and Berry Amendment, and are prohibited from using additive manufacturing processes unless specifically authorized.
Small Arms, Ordnance, and Ordnance Accessories Manufacturing

POSTED

about 24 hours ago

DEADLINE

in 4 days
View Details

Earlier notices in this NAICS code

Posted before this notice, open and closed

Ready to Pursue This Opportunity?

Get AI-powered intelligence on this solicitation and the ones like it

Every page of the solicitation package shredded into a compliance breakdown

AI-powered matching based on your capabilities and past performance

Competitor and incumbent history on the requirement

Automated alerts on amendments, Q&A deadlines, and award

Miguel
Hillary
Keith Deutsch
Christine

Join 750+ contractors already using CLEATUS