This Government Contract opportunity from Department Of Defense was posted on May 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Military-Grade Packaging and Preservation
Contract Overview
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AI Contract Overview
This contract requires the packaging of circuit card assemblies in full compliance with MIL-STD-2073-1 standards, ensuring all units are properly preserved for both domestic and international shipment. The packaging must include vacuum sealing, moisture barrier bags, and the inclusion of desiccants to protect against environmental damage during transit and storage. All work must adhere strictly to military specifications for long-term preservation, maintaining the integrity and functionality of sensitive electronic components throughout their lifecycle. The contract is classified as a subcontract under the NAICS code 561990 and is issued by the Department of Defense through SPRMM1 DLA Mechanicsburg. Responses must be submitted by June 4, 2026, at 8:30 PM Eastern Time, with no solicitation number provided. The place of performance and point of contact details are not specified, and no set-aside type is indicated, meaning the opportunity is open to all qualified subcontractors. The work is critical to supporting defense logistics and requires precise adherence to military packaging protocols to ensure operational readiness.
General Info
Agency
NAICS
Place of Performance
PA, USASet-Aside
Documents
This scope was carved out of SPRMM1-26-Q-GD57.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
SPRMM1-26-Q-GD57-CIRCUIT CARD ASSEMB
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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