This Government Contract opportunity from Department Of Defense was posted on May 14, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Military-Grade Packaging and Preservation
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract focuses on the packaging of circuit card assemblies in accordance with MIL-STD-2073-1 (Revision E), ensuring military-grade preservation standards. This includes utilizing preservation method GX, which involves moisture barrier bags, desiccants, and internal labeling to maintain the integrity and protection of sensitive electronic components. The packaging is designed to meet rigorous military specifications to safeguard the assemblies during storage and transportation. Issued by the Department of Defense through Ok DLA Aviation at Oklahoma City, the contract is a subcontract opportunity categorized under NAICS code 561990. The solicitation was posted on May 14, 2026, with a response deadline set for June 13, 2026. While specific location details for performance and points of contact are not provided, the contract represents a critical effort to supply durable, compliant packaging solutions for defense-related electronic assemblies.
General Info
Agency
NAICS
Place of Performance
OKSet-Aside
Documents
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Timeline
Submission Closed
