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Multichip Module Package for SiC Pressure Sensors

Active
Federal

Contract Overview

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This is a sole source requirement for the procurement of Multichip Module Packages for SiC Pressure Sensors, managed by the NASA Shared Services Center. The current contract, held by Sienna Technologies, Inc., is valued at 60,000 dollars and is structured as a firm fixed price agreement. The work is performed in Cleveland, Ohio, under NAICS code 334419. The existing contract is scheduled to end on November 18, 2026. Based on federal award data, this opportunity is classified as a likely recompete with a medium confidence level. The current engagement was not competed under the Simplified Acquisition Procedures.

General Info

NASA sole source firm fixed price contract for SiC Pressure Sensor packages.

NAICS

334419 - Other Electronic Component Manufacturing

Place of Performance

Cleveland, OH, 44135, USA

Set-Aside

NONE

Documents

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Timeline

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center
Contacts1 person available
OfficeSTENNIS SPACE CENTER, MS, 39529, USA
Office AddressSTENNIS SPACE CENTER, MS, 39529, USA
Contacts
Shanna Patterson

Full Description

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Predicted recompete opportunity based on federal award data.
Current Contract: 80NSSC26P0915 Incumbent: SIENNA TECHNOLOGIES, INC. Contract Value: $60,000 Potential End Date: 2026-11-18T00:00:00.000Z Competition: NOT COMPETED UNDER SAP Pricing: FIRM FIXED PRICE Classification: recompete-likely (Confidence: medium - 55/100)

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors

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