Non-Volatile Memory for Extreme Environments
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
DARPA is seeking innovative non-volatile memory solutions capable of operating reliably in extreme environments characterized by intense radiation and wide temperature fluctuations, specifically targeting applications in space exploration, nuclear energy, and strategic defense systems. Current commercial non-volatile memory technologies such as MRAM and RRAM are insufficient due to their limitations—MRAM struggles beyond 105°C, while RRAM suffers from filament instability under radiation, leading to unreliable data retention and performance. The ideal memory must possess inherent radiation hardness, eliminating the need for bulky shielding, while functioning across an unprecedented temperature range from -269°C to 600°C. It must also meet minimum performance benchmarks including a storage density of at least 1 Mb, an operating frequency of 10 MHz, high endurance for repeated read/write cycles, long-term data retention without power, and low power consumption essential for remote and resource-constrained systems. This solicitation, issued under the Small Business Innovation Research program as a total small business set-aside, is open to firms with fewer than 500 employees and requires proposers to demonstrate a viable memory device that overcomes the existing memory wall. The technology must be inherently robust without relying on external mitigation techniques, and any use of CMOS-based peripheral logic must be evaluated for potential security classification and export control implications under Department of Defense guidelines. Proposers are solely responsible for determining the appropriate classification and compliance measures for their designs, given the dual-use nature of CMOS technologies. The deadline for submissions is July 22, 2026, and the effort is part of a broader DARPA initiative to enable high-performance computing in environments where conventional electronics fail.
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