OFHC Copper Backing Plate Manufacturing and Bonding

The contract requires the precision machining and metallurgical bonding of an oxygen-free high-conductivity copper backing plate to a gold sputtering target, ensuring full compatibility with high-vacuum sputtering environments. The copper backing plate must be manufactured to exacting dimensional and surface finish specifications to enable optimal thermal and electrical performance during operation, and the bonding process must result in a defect-free, void-free interface capable of withstanding the thermal cycling and mechanical stresses inherent in sputtering systems. The work must comply with industry standards for vacuum compatibility and materials purity to prevent contamination of the sputtered film. This subcontract, issued by the NASA Shared Services Center under the NAICS code 332813 for other fabricated metal product manufacturing, is solicited with a response deadline of June 30, 2026. The performance location is not specified, but the end use is directly tied to NASA’s vacuum-based instrumentation systems. The contractor must demonstrate expertise in precision metallurgy, vacuum-compatible material handling, and bonding techniques such as diffusion bonding or brazing that ensure long-term structural integrity under operational conditions. All deliverables must be fully documented and tested to verify compliance with vacuum integrity, bond strength, and dimensional tolerances without reliance on adhesives or non-metallic fillers.