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This Government Contract opportunity from Department Of Commerce was posted on May 18, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Operator Training and Technical Documentation

Closed
Federal

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This contract involves the development and delivery of operator training programs along with technical documentation focused on the use of bonded glass wafers in research applications. It is a subcontract opportunity posted by the Department of Commerce's National Institute of Standards and Technology (NIST) with a solicitation date of May 18, 2026, and a response deadline of June 1, 2026. The contract falls under the NAICS code 611430, which pertains to professional and management development training. The work will be performed in Boulder, Colorado, specifically in the 80305 area. The contract emphasizes the importance of providing comprehensive training to operators to ensure proper handling and application of bonded glass wafers in research settings, accompanied by detailed technical documentation to support usability and knowledge transfer. This opportunity is designed to enhance research capabilities by equipping personnel with the necessary skills and information related to this specialized material.

General Info

Develop operator training and documentation for bonded glass wafers research; NIST subcontract, Boulder CO.

Agency

Department Of Commerce Nist

NAICS

611430 - Professional and Management Development Training View NAICS

Place of Performance

Boulder, CO, 80305, USA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Commerce Nist
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Commerce Nist
Office AddressN/A
ContactsNo contact information available

Full Description

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Development and delivery of operator training programs and technical documentation for bonded glass wafer use in research applications.