This Government Contract opportunity from Department Of Defense was posted on June 29, 2020. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Packaging and Hybrid Integration of Photonic Chips

Closed

Federal

Submission Closed07/14/2020, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

The contract seeks advanced packaging and hybrid integration solutions for photonic chips, focusing on fiber array attachment, electronic-photonic co-packaging, thermal management, and hermetic sealing to support deployable photonic systems. These capabilities are critical for enabling compact, reliable, and high-performance photonic subsystems that can operate in demanding operational environments, requiring precision alignment, efficient heat dissipation, and long-term environmental protection. Issued by the Defense Advanced Research Projects Agency under the Department of Defense, this subcontract targets specialized contractors with expertise in microsystems integration and photonic packaging technologies. The opportunity was posted on June 29, 2020, with a response deadline of July 14, 2020, and is classified under NAICS code 334511 for semiconductor and related device manufacturing. Performance is expected to align with DoD objectives for next-generation photonic systems, though no specific location or point of contact was provided in the solicitation details.

General Info

Advanced photonic chip packaging with fiber arrays, co-packaging, thermal management, and hermetic sealing for DoD deployable systems.

Agency

Department Of Defense → Defense Advanced Research Projects Agency (darpa)

NAICS

334511 - Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of DARPA-SN-20-56.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Notice of Intent to Award a Sole Source Contract for Modular Optical Aperture Building Blocks (MOABB) Optical Phased Arrays at Scale (OPAS) to Analog Photonics LLC

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedJun 29

subcontract

Response DeadlineJul 14

Deadline has passed

Submission Closed

07/14/2020, 08:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Defense Advanced Research Projects Agency (darpa)

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Defense Advanced Research Projects Agency (darpa)

Office AddressN/A

ContactsNo contact information available

Full Description

Provide advanced packaging solutions including fiber array attachment, electronic-photonic co-packaging, thermal management, and hermetic sealing for deployable photonic systems.