This Government Contract opportunity from Department Of Defense was posted on April 14, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Packaging and Preservation (MIL-STD-2073)
Contract Overview
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AI Contract Overview
This contract involves the military-compliant packaging and preservation of circuit card assemblies (CCAs) following the standards outlined in MIL-STD-2073. The packaging requirements emphasize the use of materials that are electrostatic discharge (ESD) safe, moisture-resistant, and provide shock protection to ensure the integrity and reliability of the components during storage and transit. The work is specified as a subcontract under the NAICS code 326199, related to plastics product manufacturing associated with packaging materials. The contracting agency for this procurement is the Department of Defense, specifically through the SPRMM1 DLA Mechanicsburg office. The place of performance is located in Mechanicsburg, with the contract posted on April 14, 2026, and a response deadline set for July 12, 2026. The solicitation focuses on meeting rigorous military packaging standards, highlighting the importance of preserving sensitive circuit card assemblies in environments prone to electrostatic and mechanical hazards. This ensures compliance with defense logistics requirements for packaging, handling, and storage of electronic components.
General Info
Agency
NAICS
Place of Performance
Mechanicsburg, PA, USASet-Aside
Documents
This scope was carved out of SPRMM126QKD97.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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