PCB board fabrication and assembly

NASA Shared Services Center is procuring the fabrication and assembly of 150 custom FPGA interface PCBs centered on the Enclustra Mars ZX3 module under a sole source contract awarded to Cirexx International, authorized under FAR 12.102(a), as it has been determined that Cirexx is the sole provider capable of meeting the technical requirements. The work involves high-density fine-pitch PCB fabrication with strict tolerances to ensure signal integrity and reliable FPGA operation, including controlled-impedance differential routing within 0.005 inches accuracy for USB and Ethernet interfaces, fine-pitch solder joint verification, electrical continuity and shorts testing, and inspection of high-density interconnects. The contract follows commercial item acquisition procedures under FAR Part 12, with performance located at NASA’s Ames Research Center, though the procuring office is based at Stennis Space Center, Mississippi. All 150 boards must be delivered with a proposed schedule that prioritizes the fastest possible fabrication, assembly, inspection, and delivery timeline, and the vendor is responsible for maintaining manufacturing consistency across all units. The solicitation number is 80NSSC26934342Q, with a NAICS code of 334412, and submissions of capabilities and qualifications to support the sole source determination must be submitted in writing by 3:00 p.m. Central Standard Time on June 4, 2026, exclusively via email to the designated point of contact, Kacey Hickman. Oral communications are prohibited, and the NASA FAR Supplement Clause 1852.215-84, Ombudsman, applies to this acquisition for dispute resolution and procedural guidance. No pricing details, payment terms, or inspection location are specified, and no competitive evaluation factors are applicable due to the sole source nature of the procurement.