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PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This pre-forecast opportunity is for the fabrication and assembly of HPSC processor cards for the National Aeronautics and Space Administration, managed through the NASA Shared Services Center. The requirement is designated as a total small business set-aside under NAICS code 334418. The current contract, held by Sierra Circuits, Inc., is valued at 28,022.31 dollars and is scheduled to end on October 19, 2026. The procurement is identified as a likely recompete with medium confidence and was previously competed under SAP using firm fixed price pricing. Interested vendors must reference the specific notice ID when submitting proposals. The primary point of contact for this requirement is Cody Guidry, and the work is associated with the Stennis Space Center in Mississippi.

General Info

Small business set-aside for NASA HPSC processor card fabrication and assembly.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

MS, 207719997, USA

Set-Aside

SBA

Documents

0

No documents available

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Timeline

Posted

pre-forecast

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center
Contacts1 person available
OfficeSTENNIS SPACE CENTER, MS, 39529, USA
Office AddressSTENNIS SPACE CENTER, MS, 39529, USA
Contacts

Full Description

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Predicted recompete opportunity based on federal award data.
Current Contract: 80NSSC26P1596 Incumbent: SIERRA CIRCUITS, INC. Contract Value: $28,022.31 Potential End Date: 2026-10-19T00:00:00.000Z Competition: COMPETED UNDER SAP Pricing: FIRM FIXED PRICE Classification: recompete-likely (Confidence: medium - 55/100)

VENDORS MUST REFERENCE THE NOTICE ID WHEN SUBMITTING A PROPOSAL FOR THIS REQUIREMENT. 


SEE THE ATTACHED SOW AND RFQ. 

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