PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This pre-forecast opportunity is for the fabrication and assembly of HPSC processor cards for the National Aeronautics and Space Administration, managed through the NASA Shared Services Center. The requirement is designated as a total small business set-aside under NAICS code 334418. The current contract, held by Sierra Circuits, Inc., is valued at 28,022.31 dollars and is scheduled to end on October 19, 2026. The procurement is identified as a likely recompete with medium confidence and was previously competed under SAP using firm fixed price pricing. Interested vendors must reference the specific notice ID when submitting proposals. The primary point of contact for this requirement is Cody Guidry, and the work is associated with the Stennis Space Center in Mississippi.
General Info
Place of Performance
MS, 207719997, USASet-Aside
Documents
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Timeline
Organization & Contact Information
Full Description
Current Contract: 80NSSC26P1596 Incumbent: SIERRA CIRCUITS, INC. Contract Value: $28,022.31 Potential End Date: 2026-10-19T00:00:00.000Z Competition: COMPETED UNDER SAP Pricing: FIRM FIXED PRICE Classification: recompete-likely (Confidence: medium - 55/100)
VENDORS MUST REFERENCE THE NOTICE ID WHEN SUBMITTING A PROPOSAL FOR THIS REQUIREMENT.
SEE THE ATTACHED SOW AND RFQ.
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Posted before this notice, open and closed
POSTED
over 1 year agoDEADLINE
N/APOSTED
over 1 year agoDEADLINE
N/AReady to Pursue This Opportunity?
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