PCB Fabrication and Bare Board Supply
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The contract involves the fabrication of multilayer printed circuit boards as bare boards to meet military specifications, with strict requirements for controlled impedance and adherence to established material standards such as FR-4. The work demands rigorous certification testing to ensure reliability and performance under demanding operational environments, aligning with the stringent quality and durability expectations of defense applications. All deliverables must comply with defined technical and procedural benchmarks to guarantee compatibility and functionality within military-grade systems. This procurement is structured as a subcontract under the Defense Logistics Agency, part of the Department of Defense, and falls under the NAICS code 334419 for other electronic component manufacturing. The solicitation was posted on July 21, 2026, and while specific performance location details are not provided, the contract is tied to the broader defense supply chain managed by the DLA. The award reference number SPE4A122G0015 and delivery identifier SPE4A626F5463 are associated with the procurement, indicating formal tracking and accountability through DLA’s systems. There is no specified set-aside type, suggesting this opportunity is open to all eligible contractors capable of meeting military-grade PCB manufacturing requirements.
General Info
Agency
NAICS
Place of Performance
Not specifiedSet-Aside
Documents
This scope was carved out of SPE4A6-26-T-7896.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
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