PCB Fabrication (Bare Board Supply)
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract involves the supply of bare printed circuit boards for prime contractors supporting DLA Aviation projects at Tinker AFB. The scope of work encompasses chemical and mechanical fabrication, including multi-layer board layout, drilling, plating, and etching, all performed in accordance with technical drawings and IPC standards. The manufacturing process utilizes copper foil, gold plating, and high-temperature substrates to ensure technical compliance. To qualify for this engagement, providers must hold IPC-A-600 and AS9100 certifications. The contract falls under NAICS code 334220 and is managed by the Department of Defense through the Ok DLA Aviation office in Oklahoma City. Responses for this opportunity are due by September 15, 2026.
General Info
Agency
NAICS
Place of Performance
OK, USASet-Aside
Documents
This scope was carved out of SPRTA126Q2063.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMBLY
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