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PCB Fabrication (Bare Board Supply)

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract involves the supply of bare printed circuit boards for prime contractors supporting DLA Aviation projects at Tinker AFB. The scope of work encompasses chemical and mechanical fabrication, including multi-layer board layout, drilling, plating, and etching, all performed in accordance with technical drawings and IPC standards. The manufacturing process utilizes copper foil, gold plating, and high-temperature substrates to ensure technical compliance. To qualify for this engagement, providers must hold IPC-A-600 and AS9100 certifications. The contract falls under NAICS code 334220 and is managed by the Department of Defense through the Ok DLA Aviation office in Oklahoma City. Responses for this opportunity are due by September 15, 2026.

General Info

Supply of bare PCBs for DLA Aviation at Tinker AFB; due September 15, 2026.

Agency

Department Of Defense → Ok DLA Aviation At Oklahoma CityView Agency

NAICS

334220 - Radio and Television Broadcasting and Wireless Communications Equipment ManufacturingView NAICS

Place of Performance

OK, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRTA126Q2063.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

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Organization & Contact Information

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AgencyDepartment Of Defense → Ok DLA Aviation At Oklahoma City
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Ok DLA Aviation At Oklahoma City
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Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies bare printed circuit boards (PCBs) for prime contractors on DLA Aviation projects at Tinker AFB. Performs chemical and mechanical fabrication including multi-layer board layout, drilling, plating, and etching according to technical drawings and IPC standards. Uses high-temperature substrates, gold plating, and copper foil. Requires IPC-A-600 and AS9100 certifications. Delivers bare printed circuit boards.

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