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PCBA (Printed Circuit Board Assembly) Manufacturing

Active

Federal

Response Deadline07/29/2026, 07:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The contract involves the fabrication and assembly of printed circuit board assemblies using surface mount and through-hole technologies to support high-reliability communication units. It requires comprehensive quality control processes including automated optical inspection, in-circuit testing, and functional testing to ensure stringent performance standards. The work is being procured under a subcontract arrangement by the Department of Defense through DLA Aviation, with the NAICS code 334418 indicating classification under other electronic component manufacturing. The solicitation was posted on July 27, 2026, and responses are due by July 29, 2026, at 7:00 PM, indicating a tight turnaround timeframe for potential suppliers. The place of performance and point of contact details are not specified, but the work must comply with federal defense manufacturing requirements for mission-critical applications.

General Info

Fabricate high-reliability PCB assemblies for DoD under tight deadline, complying with defense manufacturing standards.

Agency

Department Of Defense → DLA AviationView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

VA

Set-Aside

NONE

Documents

(0)

No documents available

AI Contract Breakdown

Uniform Contract Format

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Timeline

PostedJul 27

subcontract

Response DeadlineJul 29

Submission deadline

Response Deadline

07/29/2026, 07:00:00 PM UTCin 1 day

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA Aviation

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → DLA Aviation

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Office AddressN/A

ContactsNo contact information available

Full Description

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Fabrication and assembly of PCBAs using SMT and through-hole technologies, including AOI, ICT, and functional testing for high-reliability communication units.

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