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This Government Contract opportunity from Department Of Defense was posted on September 19, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Photolithography Exposure System

Awarded
HT942525PE042Federal

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The Army Medical Resources Acq Activity is seeking a photolithography exposure system for the U.S. Army Medical Research Institute of Chemical Defense to prototype electrode designs. The required equipment must be either a mask aligner or a direct laser writer capable of both soft and hard contact exposure. Key technical specifications include a 365nm UV light source compatible with SU-8 photoresist, a resolution of 2 microns or less, and the ability to expose areas up to a standard 6 inch wafer. The system must feature digital control via a programmable logic controller or computer and be operable outside of a clean room environment. This procurement, identified by solicitation number HT942525PE042, is designated as a total small business set-aside under NAICS code 333242. The contract is managed by the Department of Defense with the place of performance located in Gunpowder, Maryland. Points of contact for this requirement include Kenneth Grenier and Jesse Nisley.

General Info

Contract Value

$133,100

NAICS

333242 - Semiconductor Machinery Manufacturing

Place of Performance

Gunpowder, MD, 21010, USA

Set-Aside

SBA

Award Issued Date

Documents

0

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Timeline

PhaseAwarded
Posted

Award Notice

Awarded

Contract was awarded

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Army Medical Resources Acq Activity
Contacts2 people available
OfficeFORT DETRICK, MD, 21702, USA
Office AddressFORT DETRICK, MD, 21702, USA

Full Description

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The U.S. Army Medical Research Institute of Chemical Defense (USAMICD) requires a photolithography exposure system which could be a mask aligner or a direct laser writer (also known as a - maskless aligner). It shall have a UV light source that passes light through an inserted photomask onto a substrate coated in photoresist. The system shall be able to align this projected pattern precisely with the substrate being exposed. The UV light wavelength shall be compatible with SU-8 photoresist (365nm). Operating parameters shall be digitally controlled with a programmable logic controller system or included computer. Created patterns shall be repeatable with a resolution of 2 microns or less. The system shall be able to expose an area up to and including that of a standard 6 wafer. It shall be capable of both soft and hard contact exposure. The system will be used for prototyping electrode designs with precise features. It should not require a clean room to operate.

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