Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
NASA/NSSC is seeking Photonic integrated circuit packaging services for eight PICs, including wire bonding to PCBs, fiber alignment and bonding of fiber array units, along with associated process development and engineering support. The agency intends to award a sole source contract to Silitronics Solutions Inc. from Santa Clara, California, as the sole provider capable of fulfilling these specialized requirements, leveraging authority under FAR 12.102(a) to acquire commercial services. Performance will occur at NASA’s Ames Research Center, and the procurement will follow commercial item acquisition procedures outlined in FAR Part 12. The NAICS code for this effort is 813920. Interested parties may submit written capabilities and qualifications by 3:00 p.m. Central Standard Time on August 12, 2026, to assist the government in determining whether full and open competition is warranted; however, the decision to proceed without competition rests solely with the government, and oral communications are not permitted. The primary point of contact is Kacey L. Hickman at kacey.l.hickman@nasa.gov, and the NASA FAR Supplement Clause 1852.215-84, Ombudsman, applies to this procurement.
General Info
Agency
NAICS
Place of Performance
MSSet-Aside
Documents
(1)AI Contract Breakdown
Uniform Contract FormatWhat is UCF?
Uniform Contract Format (UCF) uses AI to break down any contract into standardized sections—scope, pricing, deliverables, and evaluation criteria.
Timeline
Response Deadline
Organization & Contact Information
Full Description
NASA/NSSC has a requirement for Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
NASA/NSSC intends to issue a sole source contract to silitronics solutions inc under the authority of FAR 12.102(a). It has been determined that silitronics solutions inc 2388 walsh ave Santa Clara California 95051 – 1301 United States is the sole provider of Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Ames Research Center (ARC).
The Government intends to acquire Commercial items or services using the provisions, clauses and procedures prescribed in FAR Part 12 for Commercial
The NAICS Code for this procurement is 813920.
Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 3:00 p.m. Central Standard Time on 8/12/2026. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. NASA FAR Supplement Clause 1852.215-84, Ombudsman, is applicable.
The Center Ombudsman for this acquisition can be found at https://www.hq.nasa.gov/office/procurement/regs/Procurement-Ombuds-Comp-Advocate-Listing.pdf . Primary Point of Contact: Kacey.l.hickman@nasa.gov
Similar Contracts
Same NAICS industry code
More opportunities from National Aeronautics And Space Administration → NASA Shared Services Center
Same awarding agency