Precision Insertion and Gold Bonding of Au-Plated Ni Pins

The contract calls for precision micrometer-level insertion and gold bonding of gold-plated nickel pins into blind holes on aluminum nitride boards, demanding highly specialized cleanroom micro-assembly capabilities. This work requires exacting control over alignment, force application, and thermal cycles to ensure both mechanical integrity and reliable electrical connectivity without damaging the fragile substrates. The process must be performed in a controlled environment to prevent contamination and maintain the purity of the bond interfaces, with all operations subject to rigorous in-process and final electrical validation to verify performance metrics. The work is to be performed at a facility located in Cleveland with a zip code of 44135, under the oversight of the NASA Shared Services Center on behalf of the National Aeronautics and Space Administration. The solicitation is classified as a subcontract and falls under NAICS code 334413, which pertains to semiconductor and related device manufacturing. Responses are due by June 30, 2026, at 12:00 PM, with the opportunity posted on June 26, 2026. No set-aside designation or organizational type restrictions are specified, and the point of contact information is not provided in the available data.