Trusted Semiconductor Fabrication and Wafer Processing

This contract seeks specialized subcontractors to fabricate microelectronic components using trusted domestic foundry processes, ensuring full compliance with stringent security and supply chain integrity requirements. The work requires assured access to approved fabrication facilities and maintained chain-of-custody controls throughout all stages of wafer processing to protect against counterfeiting, tampering, or unauthorized diversion. Performance must occur at a designated location in LINDA, with strict adherence to Department of Defense standards for domestic sourcing and secure manufacturing environments. The opportunity is categorized under NAICS code 334413, which pertains to semiconductor and related device manufacturing, and is intended for subcontractors capable of delivering high-assurance microelectronics for national security applications. The solicitation was posted on June 26, 2026, with a binding response deadline of July 27, 2026, at 9:00 PM Eastern Time. This is a subcontracting opportunity issued by the Defense Microelectronics Activity under the Department of Defense, indicating the critical nature of the components and the expectation of compliance with federal defense supply chain security protocols. While no specific set-aside type is indicated, all potential offerors must demonstrate proven capability in trusted fabrication environments, complete documentation of material provenance, and adherence to secure handling procedures throughout the production lifecycle. Participation requires detailed proof of facilities certification, workforce clearance eligibility, and continuous monitoring compliance to meet Defense Microelectronics Activity standards.