Precision Polishing and Surface Preparation of Glass Wafers

A subcontract has been issued for the high-precision polishing of 4-inch lithium-doped glass wafers to meet stringent surface flatness and quality requirements necessary for low-temperature anodic bonding applications. The work is to be performed at a single location in Boulder, Colorado, with a zip code of 80305, and must adhere to exacting technical specifications to ensure the wafers are suitable for sensitive microfabrication processes. The solicitation, categorized under NAICS code 332722, reflects a specialized manufacturing service focused on advanced optical and semiconductor-grade surface preparation. The opportunity was posted on July 6, 2026, with a firm response deadline of July 16, 2026, at 5:00 PM Eastern Time, leaving a limited window for qualified contractors to submit proposals. The contract is issued under the Department of Commerce, specifically by NIST, indicating a focus on research and development applications requiring exceptional material consistency and surface integrity. There is no set-aside designation or organizational type specified, and no point of contact information is provided in the public posting, suggesting that all inquiries and submissions must follow standard procedures outlined in the SAM.gov workspace linked in the posting.