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Precision Semiconductor Fabrication Services

Active

Federal

Response Deadline10/26/2026, 06:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The Precision Semiconductor Fabrication Services subcontract involves the specialized processing of semiconductor materials for prime contractors supporting NASA/NSSC particle detector projects. The scope of work focuses on precision cutting, dicing, and polishing to meet strict Max Dead Layer and Thickness specifications, as well as the fabrication of Guard Ring Widths. All operations must be conducted within ISO Class 5 cleanroom facilities using CMP systems, and personnel are required to hold cleanroom certification to deliver finished, polished semiconductor detector blanks. Managed by the NASA Shared Services Center, this project is based in Greenbelt, Maryland, under NAICS code 334413. The solicitation was posted on October 21, 2026, with a response deadline of October 26, 2026.

General Info

Subcontract for precision semiconductor fabrication and polishing for NASA particle detector projects.

Agency

National Aeronautics And Space Administration → NASA Shared Services Center

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Greenbelt, MD, 20771, USA

Set-Aside

NONE

Documents

This scope was carved out of 80NSSC27944922Q.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Custom semiconductor particle detectors

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Timeline

PostedOct 21

subcontract

Response DeadlineOct 26

Submission deadline

Response Deadline

10/26/2026, 06:00:00 PM UTCin 4 days

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

Office AddressN/A

ContactsNo contact information available

Full Description

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Performs precision cutting, dicing, and polishing of semiconductor materials for prime contractors on NASA/NSSC particle detector projects. Grinds and polishes materials to achieve Max Dead Layer and Thickness specifications and fabricates Guard Ring Widths. Utilizes CMP systems and ISO Class 5 cleanroom facilities. Requires cleanroom certification. Delivers finished, polished semiconductor detector blanks.

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