Precision Semiconductor Fixture Supply

The contract is for the supply of a custom-engineered, closed Silicon Carbide fixture designed specifically for use with the SUSS Gen2 Wafer Bonder, enabling nanoscale research through precision atomic-level wafer bonding under extreme conditions including high pressure, elevated temperatures, and controlled electric current. The fixture must meet stringent engineering specifications to ensure thermal stability, mechanical integrity, and electrical compatibility within the bonded wafer environment, supporting advanced semiconductor research applications. Delivery and installation are required at the designated facility in Gaithersburg, Maryland, with the system expected to comply with all operational and performance benchmarks defined by the National Institute of Standards and Technology under the Department of Commerce. This is a subcontract opportunity with a NAICS code of 332996, focused on other fabricated metal product manufacturing, and is open for responses until August 3, 2026. The solicitation does not specify a set-aside type or organizational restrictions, and no point of contact details are provided in the posting. Interested parties must submit proposals prior to the deadline, ensuring full alignment with the technical requirements for the custom fixture, including compatibility with the SUSS Gen2 platform and the ability to consistently perform under the high-stress conditions inherent to nanoscale wafer bonding processes. The work is solely for performance at the Gaithersburg location, and all deliverables must be fully tested and validated prior to acceptance.