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Printed Circuit Board (PCB) Fabrication and Supply

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-1150.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

PRINTED CIRCUIT BOARD

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies Printed Circuit Boards for prime contractors on DLA supply contracts, specifically NSN 5998016765958. Fabricates PCBs to technical specifications, performs marking per MIL-STD-129, and executes packaging and palletization per MIL-STD-2073-1E and RP001. Requires PCB fabrication equipment capable of producing the specific board design. Delivers 6 units of the specified PCB, packaged and marked for government delivery.

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More opportunities from Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Same awarding agency

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Solicitation # SPE7M5-27-T-1150
Solicitation SPE7M5-27-T-1150 is a request for quotations issued by the DLA Weapons Support Active Devices Division for the procurement of six printed circuit boards, identified by NSN 5998-01-676-5958 and part number 1601P-22-5014-59. The items are designated as critical application items and must comply with specific technical standards, including MIL-PRF-31032, which replaces the inactive MIL-PRF-55110 and MIL-P-50884. Additionally, the contractor must ensure laminate materials are equivalent in quality to the cancelled MIL-S-13949 standard and strictly adhere to the prohibition of intentionally adding mercury or mercury-containing compounds to the hardware. The contract specifies a delivery timeline of 143 days, with a need ship date of March 23, 2027, and an original required delivery date of August 9, 2027. Terms are FOB Origin, with inspection and acceptance occurring at the destination, specifically the DLA Distribution DDSP New Cumberland Facility in Pennsylvania. Packaging and marking must adhere to MIL-STD-2073-1E and MIL-STD-129, with palletization following RP001 requirements. Administrative requirements include electronic invoicing via the Wide Area WorkFlow system and compliance with the Buy American and Balance of Payments Program under DFARS 252.225-7001. All quotes must be submitted electronically through the DLA Internet Bid Board System.
Bare Printed Circuit Board Manufacturing

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about 12 hours ago

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in 10 days
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