This Government Contract opportunity from Department Of Defense was posted on April 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Printed Circuit Board (PCB) Fabrication
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract centers on the fabrication of bare printed circuit boards to meet military-grade standards, encompassing a full range of manufacturing processes including design for manufacturability review, circuit layout, etching, precision drilling, plating, and final production. All work must adhere to rigorous defense specifications to ensure reliability and performance in critical applications, with an emphasis on quality control throughout each stage of fabrication. The project is structured as a subcontract under the Department of Defense, specifically managed by SPRMM1 DLA Mechanicsburg, and the place of performance is identified as Mechanicsburg. The solicitation was posted on April 29, 2026, with a response deadline of May 29, 2026, at 8:30 PM Eastern Time, providing interested parties a one-month window to submit proposals. The North American Industry Classification System code 334418 applies, which covers printed circuit board manufacturing, indicating the specialized technical nature of the work required. While the solicitation number and point of contact are not provided, the procurement is part of a broader defense supply chain effort, and vendors must demonstrate capability to deliver boards compliant with military specifications without deviation.
General Info
Agency
NAICS
Place of Performance
Mechanicsburg, PA, USASet-Aside
Documents
This scope was carved out of SPRMM126QKE47.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
SPRMM1-26-Q-KE47
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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