Prototype PCB Fabrication and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract opportunity with the Office of the Secretary of Defense involves the fabrication and assembly of high-frequency printed circuit boards for compact radar projects under the DoD SBIR program. The selected provider will be responsible for creating multi-layer PCBs using high-frequency substrates such as Rogers and performing surface-mount technology assembly of RF components to deliver fully assembled and tested prototypes. The contract is a total small business set-aside under NAICS code 334418, requiring the provider to have fewer than 500 employees. To ensure technical precision and reliability, the contractor must adhere to ISO 9001 or AS9100 quality standards. Responses are due by October 7, 2026.
General Info
Agency
NAICS
Place of Performance
Not specifiedSet-Aside
Documents
This scope was carved out of OSW26BZ06-DV025.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Compact Passive Radar
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