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Provider of DOD-Qualified ESD and EMI Protective Packaging

Active

Federal

Response Deadline11/02/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract involves the provision of specialized packaging services for sensitive electronic components supporting prime contractors on Department of Defense projects. The selected provider must utilize MIL-PRF-81705 qualified ESD and EMI materials and approved protective workstations to package microcircuits. All packaging and marking activities must be executed in strict accordance with MIL-STD-2073-1E and MIL-STD-129 standards. The scope of work requires the secure packaging and marking of components for final shipment to the DLA Distribution DDWO located in Columbus, Ohio. This opportunity is managed by the DLA Weapons Support Active Devices Division under NAICS code 334419, with a response deadline set for November 2, 2026.

General Info

Specialized ESD/EMI packaging for DoD electronic components due November 2, 2026.

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

334419 - Other Electronic Component Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-1192.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, MEMORY

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Timeline

PostedOct 20

subcontract

Response DeadlineNov 2

Submission deadline

Response Deadline

11/02/2026, 05:00:00 PM UTCin 5 days

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies and performs specialized packaging of sensitive electronic components for prime contractors on DLA projects. Uses MIL-PRF-81705 qualified ESD/EMI materials and approved protective workstations to package microcircuits. Executes packaging and marking in accordance with MIL-STD-2073-1E and MIL-STD-129. Delivers components securely packaged and marked for shipment to DLA Distribution DDWO, Columbus, Ohio.

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Posted before this notice, open and closed

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