This Government Contract opportunity from Department Of Defense was posted on July 17, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Readout Integrated Circuit (ROIC) Development
Contract Overview
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The contract focuses on the design and prototyping of readout integrated circuits optimized for infrared detectors, emphasizing low-noise performance and high-speed operation tailored for demanding environments. Special attention is given to radiation-hardened variants intended for space-based applications, ensuring reliability under extreme conditions. The work requires advanced semiconductor design expertise, with a strong focus on mitigating electronic noise while maintaining rapid signal processing capabilities essential for next-generation infrared sensing systems. This subcontract opportunity, issued by the Defense Advanced Research Projects Agency under the Department of Defense, targets innovation in sensor electronics for national security and space exploration. It is classified under NAICS code 541721 for research and development in physical, engineering, and life sciences. The solicitation was posted on July 17, 2026, with a response deadline of August 14, 2026, requiring proposers to demonstrate proven capability in ROIC development, particularly in radiation tolerance and high-performance analog-digital integration for uncooled or cryogenically cooled infrared detector arrays.
General Info
Agency
NAICS
Place of Performance
VASet-Aside
Documents
This scope was carved out of DARPA-SN-26-94.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Infrared Focal Plane Arrays
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Timeline
Submission Closed
Organization & Contact Information
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